A23 電子機器の熱設計にCFD解析を応用するためのベンチマークデータの取得

• 石塚 勝

  富山県大

書誌事項

タイトル別名

• A23 Acquisition of Bench Mark Data to Apply CFD Analysis to Thermal Design of Electronic Equipment

抄録

At the PC design stage, heat flow analysis in a PC is needed. However, due to the complex printed wiring board structure, a large number of grids are required to enable precise calculation, ruling out calculations using a conventional PC. This has led to attempts to predict the temperature of an actual package by calculation based on a simplified package whose result is then modified. In this study, a compact casing and a package model are used to simulate actual notebook PCs. The performance of a diode package is experimentally obtained, and the flow inside the casing and the thermal performance of the package are studied with an obstacle placed inside the casing. This study is also conducted by aiming at acquisition of benchmark test data for CFD simulations.

収録刊行物

• 熱工学コンファレンス講演論文集

  熱工学コンファレンス講演論文集 2007 (0), 67-72, 2007

  一般社団法人 日本機械学会

キーワード

• Compact casing
• Package model
• CFD simulation
• Benchmark test data

詳細情報

• CRID: 1390001205880083200
• NII論文ID: 110007083117
• DOI: 10.1299/jsmeted.2007.67
• ISSN: 2424290X
• Web Site: https://www.jstage.jst.go.jp/article/jsmeted/2007/0/2007_67/_pdf
• 本文言語コード: ja
• データソース種別:
  • JaLC
  • Crossref
  • CiNii Articles
• 抄録ライセンスフラグ: 使用不可