Development of a Polishing Pad for Achieving Flat Workpiece Edge Shape Based on the Finite Element Method Analysis(Machine Elements and Manufacturing)

• ENOMOTO Toshiyuki

  Graduate Shcool of Engineering, Osaka University

• WANG Wenxiao

  Graduate Shcool of Engineering, Osaka University

• SAWADA Hideki

  Graduate Shcool of Engineering, Osaka University

• HIROSE Kenji

  Graduate Shcool of Engineering, Osaka University

• TABATA Norikazu

  東レ(株)

Bibliographic Information

Other Title

• 構造解析を用いた高平坦エッジ形状を実現する研磨パッドの開発(機械要素,潤滑,工作,生産管理など)
• 構造解析を用いた高平坦エッジ形状を実現する研磨パッドの開発
• コウゾウ カイセキ オ モチイタ コウヘイタン エッジ ケイジョウ オ ジツゲン スル ケンマ パッド ノ カイハツ

Abstract

In recent years, it is strongly demanded that edge roll off of workpiece be diminished in polishing silicon wafers and glass disks and, however, the conventional polishing technologies cannot meet the demand. In this study, using finite element method of a polishing model, the influences of the mechanical properties of a polishing pad on the contact stress distribution near the workpiece edge surface were investigated. As a result, it was found that a double-layered polishing pad had a possibility of suppressing the stress concentration significantly near the workpiece edge, namely, the edge roll off of workpiece. Based on the analytical result, a double-layered polishing pad having extra-fine fiber layer as upper layer and hard polymer layer as lower layer was developed. A series of polishing experiments for silicon wafers and glass plates revealed that the finishing efficiency was much higher than that obtained with conventional polishing pad and the edge roll off of the workpiece could be significantly improved.

Journal

• TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series C

  TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series C 75 (752), 1108-1113, 2009

  The Japan Society of Mechanical Engineers

Keywords

• Polishing
• Lapping
• Tool
• Accuracy
• Finite Element Method
• Polishing Pad
• Edge Roll Off
• Silicon Wafer
• Glass Disk

Details

• CRID: 1390282681365065344
• NII Article ID: 110007226828
• NII Book ID: AN00187463
• DOI: 10.1299/kikaic.75.1108
• ISSN: 18848354
• ISSN: 03875024
• ISSN: http://id.crossref.org/issn/03875024
• NDL BIB ID: 10285748
• Web Site: https://ndlsearch.ndl.go.jp/books/R000000004-I10285748
• Web Site: https://www.jstage.jst.go.jp/article/kikaic1979/75/752/75_KJ00005579309/_pdf
• Text Lang: ja
• Data Source:
  • JaLC
  • NDL
  • Crossref
  • CiNii Articles
• Abstract License Flag: Disallowed