粘接着テープを用いた半導体製造工程におけるピックアップ性能評価  [in Japanese] Evaluation of Pick-up Performance on Semiconductor Manufacturing Using an Adhesive Tape  [in Japanese]

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Author(s)

Abstract

An evaluation method of IC-chip pick-up performance using an adhesive tape is proposed. IC-chip with an adhesive layer of the adhesive tape is peeled off a base material in pick-up process, by needles sticking out backside of the base material. In the proposed evaluation method, the peel energy on various peel speeds of an adhesive tape is measured by peel test. Finite element method is applied to calculate energy release rate of pick-up process on various peel lengths. From these results, the correlation between peel speeds and peel lengths of pick-up process is obtained. The pick-up time is calculated from the correlation. Excellent pick-up performance is expected if the calculated pick-up time is shorter than actual process time. The proposed method was validated by comparing with actual pick-up process. 100, 200 and 300μm thickness chips were used for the validation. The result of actual pick-up test shows good agreement with the estimated result.

Journal

  • TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A

    TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A 76(766), 730-736, 2010

    The Japan Society of Mechanical Engineers

References:  14

Codes

  • NII Article ID (NAID)
    110007642519
  • NII NACSIS-CAT ID (NCID)
    AN0018742X
  • Text Lang
    JPN
  • Article Type
    ART
  • ISSN
    0387-5008
  • NDL Article ID
    10757083
  • NDL Source Classification
    ZM16(科学技術--科学技術一般--工業材料・材料試験)
  • NDL Call No.
    Z14-737
  • Data Source
    CJP  NDL  NII-ELS  J-STAGE 
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