粘接着テープを用いた半導体製造工程におけるピックアップ性能評価 [in Japanese] Evaluation of Pick-up Performance on Semiconductor Manufacturing Using an Adhesive Tape [in Japanese]
Access this Article
Search this Article
An evaluation method of IC-chip pick-up performance using an adhesive tape is proposed. IC-chip with an adhesive layer of the adhesive tape is peeled off a base material in pick-up process, by needles sticking out backside of the base material. In the proposed evaluation method, the peel energy on various peel speeds of an adhesive tape is measured by peel test. Finite element method is applied to calculate energy release rate of pick-up process on various peel lengths. From these results, the correlation between peel speeds and peel lengths of pick-up process is obtained. The pick-up time is calculated from the correlation. Excellent pick-up performance is expected if the calculated pick-up time is shorter than actual process time. The proposed method was validated by comparing with actual pick-up process. 100, 200 and 300μm thickness chips were used for the validation. The result of actual pick-up test shows good agreement with the estimated result.
- TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A
TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A 76(766), 730-736, 2010
The Japan Society of Mechanical Engineers