書誌事項
- タイトル別名
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- D11 Fundamental Investigation into High Quality Laser Dicing Method for Solid Type Molded Composite Material
抄録
Laser cutting has been expected as a new dicing method of semiconductor package, since the laser beam processing can control the cut shape easily with a narrow kerf. However, since the distance between cutting edge and silicon chip becomes narrow according to the size reduction of semiconductor package, the laser dicing with low heat affected zone is required. In this study, laser cutting characteristics of solid type molded composite material with the cooled gas were experimentally investigated. The cooled gas flow from the side of a coaxial assist gas for laser beam led to straighter kerf shape and cut surface with low heat affected zone. The combination of coaxial assist gas and side cooled gas made it possible to obtain constant and narrow kerf width for various feed rates. Moreover, the difference of kerf width between irradiation side and exit side became smaller by supplying the side cooled gas.
収録刊行物
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- 生産加工・工作機械部門講演会 : 生産と加工に関する学術講演会
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生産加工・工作機械部門講演会 : 生産と加工に関する学術講演会 2008.7 (0), 133-134, 2008
一般社団法人 日本機械学会
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詳細情報 詳細情報について
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- CRID
- 1390001205900609152
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- NII論文ID
- 110007705570
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- ISSN
- 24243094
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- 本文言語コード
- ja
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- データソース種別
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- JaLC
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- CiNii Articles
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- 抄録ライセンスフラグ
- 使用不可