C11 Effect of Fullerene Poly-hydroxide on Cu-CMP Process(Abrasive finishing technology)

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  • KISHIDA Hirotaka
    Department of Mechanical Engineering and Systems, Graduate school of Engineering, Osaka University
  • HAYASHI Terutake
    Department of Mechanical Engineering and Systems, Graduate school of Engineering, Osaka University
  • TAKAYA Yasuhiro
    Department of Mechanical Engineering and Systems, Graduate school of Engineering, Osaka University
  • KOKUBO Ken
    Division of Applied Chemistry, Graduate School of Engineering, Osaka University
  • SUZUKI Keisuke
    Nitta Haas Incorporated

抄録

A novel CMP process using poly-hydroxylated fullerene (C_<60>(OH)_<36>) is proposed. It has been previously reported that a copper surface can be improved considerably using C_<60>(OH)_<36> molecules as abrasive grains. In this report, the chemical effect of fullerene hydroxide C_<60>(OH)_<36> used for the CMP process is discussed. It was found that a copper-C_<60>(OH)_<36> complex layer is formed by the reaction of hydrogen peroxide and C_<60>(OH)_<36>; the removal of this layer is the removal mechanism of matter using fullerene poly-hydroxide used in the Cu-CMP process.

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