書誌事項
- タイトル別名
-
- A33 Investigation of Micro-machining Characteristics and Phenomenon of Monocrystalline Silicon by Harmonics of Nd:YAG Laser
抄録
Monocrystalline silicon has played an important role as semiconductors in the electronical and the electrical industries. High efficiency and high quality manufacturing process of silicon is required for the continuous development of these fields. However, debris and cracks remained on machined surface by the traditional mechanical processing because of its high brittleness. On the other hand, laser beam machining could realize the high-speed processing. However, heat affected zone and dross remained in the case of fundamental wavelength of Nd:YAG laser. In comparison, it is expected that harmonics of Nd:YAG laser make it possible to perform the high precision micro-machining with small heat affected zone and crack because of its high photon energy. In this study, the influence of wavelength and surrounding pressure was investigated with observing process behavior using a high-speed shutter camera in micro-machining of monocrystalline silicon by fundamental wavelength and harmonics of Nd:YAG laser.
収録刊行物
-
- 生産加工・工作機械部門講演会 : 生産と加工に関する学術講演会
-
生産加工・工作機械部門講演会 : 生産と加工に関する学術講演会 2010.8 (0), 73-74, 2010
一般社団法人 日本機械学会
- Tweet
詳細情報 詳細情報について
-
- CRID
- 1390282680876679808
-
- NII論文ID
- 110008740165
-
- ISSN
- 24243094
-
- 本文言語コード
- ja
-
- データソース種別
-
- JaLC
- Crossref
- CiNii Articles
-
- 抄録ライセンスフラグ
- 使用不可