I121 水蒸気と水の混合噴流を用いたウェハ表面レジスト除去(一般講演(4))

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  • I121 Resist Removal from a Wafer Surface by Steam-Water Mixed Spray

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As part of the effort to elucidate the potential of steam-water mixed spray, a high-speed multi-phase thermal fluid, we conducted a series of experiments with resist-coated silicon wafers as the target of the spray. We measured the amount of the resist removed by the spray, and found that it depends on several parameters such as the thickness and mechanical strength of the resist. The results suggest that the resist removal by the spray is essentially a physical process, and the impact of the spray can be controlled, implying the application potentiality of the spray.

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