S041012 パルス通電焼結法を用いたマイクロパターンを有する基板作製([S041-01]粉末成形とその評価(1))

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タイトル別名
  • S041012 Fabrication of Micro-Patterning Substrate by Pulse Electric Current Sintering

抄録

To fabricate the glass substrate that has micro-patterns such as bio-chip,a rapid fabrication process of the micro-meter patterned substrate by pulse electric current sintering method was tried.A low melting point glass substrate was fabricated using pulse electric current sintering method.A micro- convex pattern(ridge) was fabricated by an ion milling machine on the surface of graphite punch.The width and depth of the convex lines on the graphite punch's surface are approximately 100 micro-meter and 8.6 micro-meter,respectively.Using this punch,the powder of low melting point glass was sintered by pulse electric current sintering.The width and height of the concave lines(grooves) on the glass substrate are approximately same as the width and height of the grooves,respectively.This results shows that the glass devises that have micro-meter patterned such as the biochips can be fabricated by pulse electric current sintering method.

収録刊行物

  • 年次大会

    年次大会 2013 (0), _S041012-1-_S041012-3, 2013

    一般社団法人 日本機械学会

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