J012034 フローハンダ付け工程のCFDシミュレーション : 狭いマスクキャリア開口部の場合([J012-03]電子情報機器、電子デバイスの強度・信頼性評価と熱制御(3))

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タイトル別名
  • J012034 CFD simulation of flow soldering : Case of narrow opening between mask

抄録

Flow soldering process with a simple model has been studied using CFD. Through-hole printed circuit board with surface mounted components is the object of this study. In this process, surface mounted components are soldered first and covered with a mask; then through-hole components without a mask is soldered by dipping the board into a solder bath. We to investigate the solder flow in narrow aisle between the masks. The effect of computational domain is clarified. Flow in solder causes surface deformation and increases surface rise rate.

収録刊行物

  • 年次大会

    年次大会 2013 (0), _J012034-1-_J012034-4, 2013

    一般社団法人 日本機械学会

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