J0610201 ディップはんだ付け工程の熱流動シミュレーション : 水平移動する基板による液面変形と温度変動

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タイトル別名
  • J0610201 Numerical simulations of thermo-fluid process in dip soldering : Fluctuation of solder surface and temperature field caused by a horizontally moving printed circuit board

抄録

Dip soldering process with a simple model has been studied using CFD. The horizontal movement of PCB and the variation of temperature field are considered in this study. Open source CFD software OpenFOAM is utilized to simulate two phase thermal-flow of air and solder with moving mesh. Relatively large movement of PCB is reproduced by using two types of mesh and mapping numerical results between two meshes. Natural convection in liquid solder is observed. Moving PCB changes the height of solder surface. The un-equivalent level of solder surface causes flow under the PCB.

収録刊行物

  • 年次大会

    年次大会 2015 (0), _J0610201--_J0610201-, 2015

    一般社団法人 日本機械学会

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