New Three-Dimensional Integration Technology Based on Reconfigured Wafer-on-Wafer Bonding Technique
収録刊行物
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- IEEE International Electron Devices Meeting, 2007. IEDM 2007
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IEEE International Electron Devices Meeting, 2007. IEDM 2007 (2007), 985-988, 2007
Institute of Electrical and Electronics Engineers
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詳細情報 詳細情報について
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- CRID
- 1573950402368173184
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- NII論文ID
- 120002070107
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- Web Site
- http://hdl.handle.net/10097/46418
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- 本文言語コード
- en
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- データソース種別
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- CiNii Articles