Detection of defects at BGA solder joints by using X-ray imaging

• Sumimoto, Tetsuhiro

• Maruyama, Toshinori

• Azuma, Yoshiharu

• Goto, Sachiko

• Mondou, Munehiro

• Furukawa, Noboru

• Okada, Saburo

抄録

In the surface mount technology, a ball grid array (BGA) has been used in the production of PC boards. This paper deals with the detection of defects at BGA solder joints in PC boards by using X-ray imaging. Types of defects at BGA solder joints are solder bridge, missing connection, solder voids, open connection and misregistration of parts. The problems of image analysis for the detection of defects at BGA solder joints are the detection accuracy and image processing time according to the speed of the production line. To get the design data for the development of the inspection system used in the surface mount process, it is important to develop image analysis techniques based on X-ray image data. At the first step of our study, we attempt to detect the characteristics of the solder bridges based on the image analysis technique.

収録刊行物

• Industrial Technology

  Industrial Technology 1 191-196, 2002-12

キーワード

• X-ray imaging
• ball grid arrays
• inspection
• printed circuit manufacture
• quality control
• surface mount technology

詳細情報

• CRID: 1050283687311852160
• NII論文ID: 120002311792
• Web Site: https://ousar.lib.okayama-u.ac.jp/32919
• 本文言語コード: en
• 資料種別: journal article
• データソース種別:
  • IRDB
  • CiNii Articles