The effect of dentine surface preparation and reduced application time of adhesive on bonding strength

• Saikaew, Pipop

• Chowdhury, A. F. M. Almas

• Fukuyama, Mai

• Kakuda, Shinichi

• Carvalho, Ricardo M.

• Sano, Hidehiko

抄録

Objective: This study evaluated the effects of surface preparation and the application time of adhesives on the resin-dentine bond strengths with universal adhesives. Methods: Sixty molars were cut to exposed mid-coronal dentine and divided into 12 groups (n = 5) based on three factors; (1) adhesive: G-Premio Bond (GP, GC Corp., Tokyo, Japan), Clearfil Universal Bond (CU, Kuraray Noritake Dental Inc., Okayama, Japan) and Scotchbond Universal Adhesive (SB, 3M ESPE, St. Paul, MN, USA); (2) smear layer preparation: SiC paper ground dentine or bur-cut dentine; (3) application time: shortened time or as manufacturer's instruction. Fifteen resin-dentine sticks per group were processed for microtensile bond strength test (mu TBS) according to non-trimming technique (1 mm(2)) after storage in distilled water (37 degrees C) for 24 h. Data were analyzed by three-way ANOVA and Dunnett T3 tests (alpha = 0.05). Fractured surfaces were observed under scanning electron microscope (SEM). Another 12 teeth were prepared and cut into slices for SEM examination of bonded interfaces. Results: mu TBS were higher when bonded to SiC-ground dentine according to manufacturer's instruction. Bonding to bur-cut dentine resulted in significantly lower mu TBS (p < 0.000). Shortening the application time resulted in significantly lower bond strength for CU on SiC and GP on bur-cut dentine. SEM of fractured surfaces revealed areas with a large amount of porosities at the adhesive resin interface. This was more pronounced when adhesives were bonded with a reduced application time and on bur cut dentine. (C) 2016 Elsevier Ltd. All rights reserved.

収録刊行物

• Journal of dentistry

  Journal of dentistry 47 63-70, 2016-04

  Elsevier

キーワード

• Universal adhesives
• Microtensile bond strength
• Bonding application time
• Surface preparation
• SEM

詳細情報

• CRID: 1050845763950549632
• NII論文ID: 120006024336
• NII書誌ID: AA00696556
• ISSN: 1879176X
• ISSN: 03005712
• HANDLE: 2115/65016
• 本文言語コード: en
• 資料種別: journal article
• データソース種別:
  • IRDB
  • CiNii Articles