High hardness and low dielectric constant thin films with oriented urea oligomers by physical vapor deposition
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Oligomers of undecylurea (OUA11) thin films with a high crystallinity, surface hardness, perpendicular orientation, and low dielectric constant were fabricated by physical vapor deposition. The thin films were composed of single OUA11, which has a relatively high molecular weight (Mw: 2500, Mn: 1200) and could be vapor-deposited without thermal decomposition. These films had a much higher crystallinity and a high surface hardness level of 9H in the pencil hardness test. The dielectric constant of the OUA11 films is estimated to be 2.1–2.3 in the frequency range of 1 Hz–0.1 MHz, which is lower than that of typical low dielectric constant (low-k) materials. These physical and electrical properties are caused by the unique structure with the molecular dipoles-oriented parallel to the electrodes on the substrate and the strong intermolecular hydrogen bonds. The unique structure could not be observed with spin-coating and is specific to the vapor-deposited films. We expect that the OUA11 films with a high hardness and a low dielectric constant can be used not only as protective coatings but also as electronic materials.
収録刊行物
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- Journal of Materials Science
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Journal of Materials Science 54 (3), 2483-2492, 2019-02
Springer
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詳細情報 詳細情報について
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- CRID
- 1050575520346249856
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- NII論文ID
- 120006764471
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- NII書誌ID
- AA00701725
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- ISSN
- 15734803
- 00222461
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- HANDLE
- 20.500.14094/90006459
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- 本文言語コード
- en
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- 資料種別
- journal article
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- データソース種別
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