Room-temperature direct bonding of diamond and Al

• Liang, Jianbo

• Yamajo, Shoji

• Kuball, Martin

• Shigekawa, Naoteru

Abstract

Direct bonding of diamond and Al is achieved by surface activated bonding at room temperature. The interfacial structures of the diamond/Al bonding interface with annealing at different temperatures are investigated under in-situ annealing in a transmission electron microscope (TEM). An amorphous layer with a thickness of 4 ± 0.5 nm is formed at the bonding interface without annealing, the thickness of the amorphous layer decreases with increasing annealing temperature, the amorphous layer vanished after annealing at 600 ℃. No structural defects are observed at the bonding interface with annealing at different temperatures.

Journal

• Scripta Materialia

  Scripta Materialia 159 58-61, 2019-01-15

  Elsevier

Keywords

• Diamond/Al direct bonding
• Surface activated bonding
• Bonding interface
• Amorphous layer

Details

• CRID: 1050005667186134784
• NII Article ID: 120006957157
• NII Book ID: AA11540027
• ISSN: 13596462
• DOI: 10.1016/j.scriptamat.2018.09.016
• Web Site: https://dlisv03.media.osaka-cu.ac.jp/il/meta_pub/G0000438repository_13596462-159-58
• Web Site: https://api.elsevier.com/content/article/PII:S1359646218305670?httpAccept=text/xml
• Web Site: https://api.elsevier.com/content/article/PII:S1359646218305670?httpAccept=text/plain
• Text Lang: en
• Article Type: journal article
• Data Source:
  • IRDB
  • Crossref
  • CiNii Articles
  • KAKEN