Dissimilar joining of alumina to aluminum at room temperature without applying a loading by two-step deposition

• 内藤, 江児

  Graduate School of Energy Science, Kyoto University

• 出口, 総一郎

  Graduate School of Energy Science, Kyoto University

• 袴田, 昌高

  Graduate School of Energy Science, Kyoto University

• 馬渕, 守

  Graduate School of Energy Science, Kyoto University

抄録

Low temperature joining is desirable for aluminum-ceramics joining because aluminum has a large coefficient of thermal expansion. In the present work, joining of Al₂O₃ to Al was performed at room temperature by the two-step deposition method including Ni electroless deposition and Cu electrodeposition. The joining strength was increased, and the fracture mode changed from a fracture at the Ni/Al₂O₃ interface to that in the Al₂O₃ substrate by using a porous Al₂O₃ or by etching a dense Al₂O₃ surface. Thus, the present work demonstrates that Al₂O₃ and Al are successfully joined at room temperature without applying a load by the deposition method.

収録刊行物

• Materials Letters

  Materials Letters 286 129245-, 2021-03-01

  Elsevier BV

キーワード

• Joining
• Aluminum
• Alumina
• Electrodeposition
• Electroless deposition

詳細情報

• CRID: 1050568772230236416
• NII論文ID: 120006960295
• ISSN: 0167577X
• DOI: 10.1016/j.matlet.2020.129245
• HANDLE: 2433/261745
• Web Site: https://api.elsevier.com/content/article/PII:S0167577X20319534?httpAccept=text/xml
• Web Site: https://api.elsevier.com/content/article/PII:S0167577X20319534?httpAccept=text/plain
• 本文言語コード: ja
• 資料種別: journal article
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