How can molecular simulations contribute to thermal engineering

• MATSUMOTO Mitsuhiro

  Department of Mechanical Engineering and Science, Graduate School of Engineering, Kyoto University

書誌事項

タイトル別名

• How Can Molecular Simulations Contribute to Thermal Engineering ?- Topics from Microbubbles and Microscale Heat Conduction -

抄録

This review covers several problems in thermal engineering which require consideration in nano-scale or at molecular level. One example in nanofluidics is “nano bubbles”; molecular simulation reveals that surface tension and vapor pressure of a spherical bubble hardly depend on its size and that the classical Young-Laplace equation is applicable even to a bubble as small as several nano meters. Combined with CFD schemes, molecular simulation can also treat oscillating dynamics of nanobubbles. Another example comes from solid-state physics, i.e., thermophysical properties of nano-scale elements. As the thickness of solid thin film decreases to “phonon mean free path”, the apparent thermal conductivity becomes smaller, the mechanism of which molecular simulation can explain.

収録刊行物

• Journal of Thermal Science and Technology

  Journal of Thermal Science and Technology 3 (2), 309-318, 2008

  一般社団法人日本機械学会・社団法人日本伝熱学会

キーワード

• Molecular Simulation
• Microbubble
• Nanofluidics
• Thermophysical Properties
• Thermal Conductivity

詳細情報

• CRID: 1390282680222658560
• NII論文ID: 130000099085
• DOI: 10.1299/jtst.3.309
• ISSN: 18805566
• HANDLE: 2433/88949
• Web Site: http://www.jstage.jst.go.jp/article/jtst/3/2/3_2_309/_pdf
• 本文言語コード: en
• データソース種別:
  • JaLC
  • IRDB
  • Crossref
  • CiNii Articles
  • KAKEN
• 抄録ライセンスフラグ: 使用不可