Evaluation of thiouracil-based adhesive systems for bonding cast silver-palladium-copper-gold alloy

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Author(s)

    • Yamashita Miyuki
    • Division of Applied Oral Sciences, Nihon University Graduate School of Dentistry
    • Koizumi Hiroyasu
    • Department of Fixed Prosthodontics, Nihon University School of Dentistry|Division of Advanced Dental Treatment, Dental Research Center, Nihon University School of Dentistry
    • Ishii Takaya
    • Department of Fixed Prosthodontics, Nihon University School of Dentistry
    • Furuchi Mika
    • Department of Fixed Prosthodontics, Nihon University School of Dentistry|Division of Advanced Dental Treatment, Dental Research Center, Nihon University School of Dentistry
    • Matsumura Hideo
    • Department of Fixed Prosthodontics, Nihon University School of Dentistry|Division of Advanced Dental Treatment, Dental Research Center, Nihon University School of Dentistry

Abstract

This study aimed to evaluate the effect of adhesive systems based on a thiouracil monomer on bonding to silver-palladium-copper-gold (Ag-Pd-Cu-Au) alloy (Castwell M.C.12). Disk specimens were cast from the alloy and then air-abraded with alumina. The disks were bonded using six bonding systems selected from four primers and three luting materials. Shear bond strengths were determined both before and after thermocycling. Bond strength varied from 2.7 MPa to 32.0 MPa. Three systems based on a thiouracil monomer (MTU-6) showed durable bonding to the alloy, with post-thermocycling bond strengths of 22.4 MPa for the Metaltite (MTU-6) primer and Super-Bond, a tri-<I>n</I>-butylborane (TBB) initiated resin, 9.0 MPa for the Multi-Bond II resin, and 8.1 MPa for the Metaltite and Bistite II system. It can be concluded that a combination of thiouracil-based primer and TBB initiated resin is effective for bonding Ag-Pd-Cu-Au alloy. (J Oral Sci 52, 405-410, 2010)

Journal

  • Journal of Oral Science

    Journal of Oral Science 52(3), 405-410, 2010

    Nihon University School of Dentistry

Cited by:  1

Codes

  • NII Article ID (NAID)
    130000438420
  • Text Lang
    ENG
  • Article Type
    Journal Article
  • ISSN
    1343-4934
  • Data Source
    CJPref  J-STAGE 
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