局部的な強制対流冷却を有する薄型筺体内流体解析への熱流体抵抗網法の適用  [in Japanese] Flow and Thermal Resistance Network Analysis of Airflow and Heat Transfer in a Thin Electronic Equipment Enclosure with a Localized Finned Heat Sink  [in Japanese]

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Author(s)

Abstract

A model of electronic equipment considered in the present study has the characteristics that are commonly seen in modern compact electronic equipment. It has a set of multiple (five) heat sources distributed over a 8 x 10 cm<sup>2</sup> board. The equipment box is so thin that cooling air is permitted only in a corner of the box where a finned heat sink (1 cm (H) x 2 cm (W) x 6 cm (L)) is installed on the board. Heat from the heat sources is conducted through the board, and dissipated to the air from the heat sink. The model has a level of physical complexity that requires very large computational resources if computational fluid dynamic (CFD) analysis is performed. Resistance network analysis allows fast analysis of airflow and heat transfer; however, the estimation of resistance elements in the airflow and thermal networks holds the key to achieve high accuracy of analysis. Actual processes of airflow and heat transfer are complex when examined locally. In the present report we show how such locally complex physical processes can be represented by resistance elements. The analytical results are compared with the experimental data. Good agreement between them validates our methodology.

Journal

  • Thermal Science and Engineering

    Thermal Science and Engineering 19(3), 81-93, 2011

    The Heat Transfer Society of Japan

Codes

  • NII Article ID (NAID)
    130001490404
  • Text Lang
    JPN
  • ISSN
    0918-9963
  • Data Source
    J-STAGE 
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