Development of an Efficient Inverse Analysis Technique for Monitoring of Electroplating Current Density on Target Region in LSI Fabrication
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- KISHIMOTO Yoshinao
- Department of Mechanical Engineering, Tokyo City University
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- KOBAYASHI Yukiyoshi
- Department of Mechanical Engineering, Tokyo City University
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- OHTSUKA Toshihisa
- Department of Mechanical Engineering, Tokyo City University
Abstract
Our research focuses on the techniques for monitoring the current density distribution of the real-time electroplating. In the previous research, a novel technique to estimate electroplating current densities on plated surfaces from the data of the electric potentials in the plating cells has been developed for LSI fabrication technology. The technique described in this paper has been applied for a 2 dimensional (2D) analysis in our previous research work; however, the 2D approach limits the application of the proposed method. In this research, we applied the monitoring technique with 3 dimensional (3D) analysis. Although the inverse analysis using the 3D analysis tends to be large scale, it is important for the practical usage to monitor current density on target region accurately and efficiently. Therefore we have developed an efficient inverse analysis technique for monitoring of electroplating current density on the target region and verified the effectiveness of the proposed technique by using numerical simulations.
Journal
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- Journal of Solid Mechanics and Materials Engineering
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Journal of Solid Mechanics and Materials Engineering 5 (12), 656-668, 2011
The Japan Society of Mechanical Engineers
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Keywords
Details 詳細情報について
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- CRID
- 1390282680242515072
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- NII Article ID
- 130002072376
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- ISSN
- 18809871
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- Text Lang
- en
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- Data Source
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- JaLC
- Crossref
- CiNii Articles
- KAKEN
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- Abstract License Flag
- Disallowed