A High-Signal-Integrity PCB Trace Composed of Multiple Segments for GHz VLSI Packaging: Its Prototyping and Performance Analysis

• Yasunaga Moritoshi

  Graduate School of Systems and Information Engineering, University of Tsukuba

• Shimada Hiroki

  Graduate School of Systems and Information Engineering, University of Tsukuba

• Akita Shohei

  Graduate School of Systems and Information Engineering, University of Tsukuba

• Ishiguro Masami

  Graduate School of Systems and Information Engineering, University of Tsukuba

• Yoshihara Ikuo

  Faculty of Engineering, Miyazaki University

抄録

High signal integrity (SI) is strongly required in PCB traces under GHz clock frequencies for the next generation of VLSI packaging. Unfortunately, however, conventional techniques based on characteristic impedance matching cannot work well with GHz digital signals. In order to overcome this problem, we have previously proposed a novel PCB trace structure called "Segmental Transmission Line (STL)." In this paper, we design STLs for GHz bus-systems in which a high SI is indispensable, and demonstrate the high effectiveness of the STL showing the waveforms observed in the STL prototypes. Furthermore, the STL is analyzed in the frequency domain to demonstrate its mechanism of high robustness against frequency fluctuations.

収録刊行物

• Transactions of The Japan Institute of Electronics Packaging

  Transactions of The Japan Institute of Electronics Packaging 4 (1), 44-51, 2011

  一般社団法人エレクトロニクス実装学会

キーワード

• Signal Integrity
• Printed Circuit Board
• PCB
• Transmission Line
• Impedance Matching
• Genetic Algorithm

詳細情報

• CRID: 1390001205315150464
• NII論文ID: 130002136671
• DOI: 10.5104/jiepeng.4.44
• ISSN: 18848028
• ISSN: 18833365
• Web Site: https://www.jstage.jst.go.jp/article/jiepeng/4/1/4_1_44/_pdf
• 本文言語コード: en
• データソース種別:
  • JaLC
  • Crossref
  • CiNii Articles
  • KAKEN
• 抄録ライセンスフラグ: 使用不可