Low-power wireless on-chip microparticle manipulation with process variation compensation

• Kishiwada Yasushi

  Graduate School of Engineering, Osaka University

• Iwasaki Hirosuke

  Graduate School of Engineering, Osaka University

• Ueda Shun

  Graduate School of Engineering, Osaka University

• Dei Yoshiaki

  Graduate School of Engineering, Osaka University

• Miyawaki Yusuke

  Graduate School of Engineering, Osaka University

• Matsuoka Toshimasa

  Graduate School of Engineering, Osaka University

抄録

A chip with which to manipulate microparticles using wireless power transfer and pulse-driven dielectrophoresis has been designed and fabricated using a 0.18-µm CMOS process. The chip enables microparticle manipulation using a 0.35-V power supply and a 10∼100kHz clock, which are generated on the chip by means of an on-chip coil, a rectifier and a ring oscillator circuit with process variation compensation circuits. The proposed process variation compensation with effective gate-width tuning as well as body biasing can achieve stable 0.35-V operation, allowing a 87% reduction in the power consumption of digital circuits on the chip compared to previous work.

収録刊行物

• IEICE Electronics Express

  IEICE Electronics Express 10 (13), 20130407-20130407, 2013

  一般社団法人 電子情報通信学会

キーワード

• dielectrophoresis
• microparticle manipulation
• CMOS
• wireless power transfer
• low-voltage operation

詳細情報

• CRID: 1390282680190050944
• NII論文ID: 130003364907
• DOI: 10.1587/elex.10.20130407
• ISSN: 13492543
• HANDLE: 11094/51665
• Web Site: https://www.jstage.jst.go.jp/article/elex/10/13/10_10.20130407/_pdf
• 本文言語コード: en
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