Tensile Properties and Viscoelastic Model of a Polyimide Thin Film

• ZHANG Shengde

  Mater. Sci. Res. Lab., CRIEPI

• MORI Syuhei

  Graduate School, Ritsumeikan Univ.

• NAGASAWA Tadashi

  KYOCERA SLC, Head Office

• KOBAYASHI Kaoru

  KYOCERA SLC, Head Office

• SAKANE Masao

  Dept. of Mech. Eng., Ritsumeikan Univ.

Bibliographic Information

Other Title

• ポリイミド系樹脂薄膜の引張特性および粘弾性モデルによる表示
• ポリイミドケイ ジュシ ハクマク ノ ヒッパリ トクセイ オヨビ ネンダンセイ モデル ニ ヨル ヒョウジ

Abstract

This paper presents tensile properties of a new developed polyimide thin film used in electronic devices. Tensile tests were performed to determine Young's modulus, proportional limit, yield stress, ultimate tensile strength and elongation of the polyimide film at three strain rates and three temperatures. Effects of strain rate and temperature on the tensile properties were discussed. There was a little anisotropy of tensile properties caused by injection direction in the polyimide film. Young's modulus, proportional limit, yield stress and ultimate tensile strength increased with increasing the strain rate. Only elongation decreased with the strain rate. Young's modulus, proportional limit, yield stress and ultimate tensile strength decreased with increasing temperature but elongation increased. Applicability of a viscoelastic model for describing the stress-strain curves of the polyimide film was proposed.

Journal

• Journal of the Society of Materials Science, Japan

  Journal of the Society of Materials Science, Japan 62 (2), 149-155, 2013

  The Society of Materials Science, Japan

Keywords

• Polyimide
• Thin film
• Tensile properties
• Viscoelastic model
• Electronic device

Details

• CRID: 1390001205445873280
• NII Article ID: 130003367132
• NII Book ID: AN00096175
• DOI: 10.2472/jsms.62.149
• ISSN: 18807488
• ISSN: 05145163
• NDL BIB ID: 024296133
• Web Site: https://ndlsearch.ndl.go.jp/books/R000000004-I024296133
• Text Lang: ja
• Data Source:
  • JaLC
  • NDL
  • Crossref
  • CiNii Articles
  • KAKEN
• Abstract License Flag: Disallowed