Advances in High-Density Inter-Chip Interconnects with Photonic Wiring

• URINO Yutaka

  Institute for Photonics-Electronics Convergence System Technology (PECST) Photonics Electronics Technology Research Association (PETRA)

• NOGUCHI Yoshiji

  Institute for Photonics-Electronics Convergence System Technology (PECST) National Institute of Advanced Industrial Science and Technology (AIST)

• HATORI Nobuaki

  Institute for Photonics-Electronics Convergence System Technology (PECST) Photonics Electronics Technology Research Association (PETRA)

• ISHIZAKA Masashige

  Institute for Photonics-Electronics Convergence System Technology (PECST) Photonics Electronics Technology Research Association (PETRA)

• USUKI Tatsuya

  Institute for Photonics-Electronics Convergence System Technology (PECST) Photonics Electronics Technology Research Association (PETRA)

• FUJIKATA Junichi

  Institute for Photonics-Electronics Convergence System Technology (PECST) Photonics Electronics Technology Research Association (PETRA)

• YAMADA Koji

  Institute for Photonics-Electronics Convergence System Technology (PECST) PETRA

• HORIKAWA Tsuyoshi

  Institute for Photonics-Electronics Convergence System Technology (PECST) National Institute of Advanced Industrial Science and Technology (AIST)

• NAKAMURA Takahiro

  Institute for Photonics-Electronics Convergence System Technology (PECST) Photonics Electronics Technology Research Association (PETRA)

• ARAKAWA Yasuhiko

  Institute for Photonics-Electronics Convergence System Technology (PECST) The University of Tokyo

抄録

One of the most serious challenges facing the exponential performance growth in the information industry is a bandwidth bottleneck in inter-chip interconnects. We therefore propose a photonics-electronics convergence system with a silicon optical interposer. We examined integration between photonics and electronics and integration between light sources and silicon substrates, and we fabricated a conceptual model of the proposed system based on the results of those examinations. We also investigated the configurations and characteristics of optical components for the silicon optical interposer: silicon optical waveguides, silicon optical splitters, silicon optical modulators, germanium photodetectors, arrayed laser diodes, and spot-size converters. We then demonstrated the feasibility of the system by fabricating a high-density optical interposer by using silicon photonics integrated with these optical components on a single silicon substrate. As a result, we achieved error-free data transmission at 12.5Gbps and a high bandwidth density of 6.6Tbps/cm² with the optical interposer. We think that this technology will solve the bandwidth bottleneck problem.

収録刊行物

• IEICE Transactions on Electronics

  IEICE Transactions on Electronics E96.C (7), 958-965, 2013

  一般社団法人 電子情報通信学会

キーワード

• integrated optics
• integrated optoelectronics
• optical devices
• optical interconnections

詳細情報

• CRID: 1390001204378083328
• NII論文ID: 130003370444
• DOI: 10.1587/transele.e96.c.958
• ISSN: 17451353
• ISSN: 09168524
• Web Site: https://www.jstage.jst.go.jp/article/transele/E96.C/7/E96.C_958/_pdf
• 本文言語コード: en
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