Fabrication of Ni-W Electroformed Mold for Thermal Imprint of Borosilicate Glass

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  • 硼珪酸ガラスを対象とした熱インプリント用Ni-W電鋳金型の作製

Abstract

We proposed an electroformed mold for thermal imprint of borosilicate glass in this paper. The mold was made of Ni-W electrodeposition film that was superior to heat-resistance and removing glass. The resist pattern for electroforming was fabricated with SU8-10. Ni-W solution for electroforming was developed by mixing nickel sulfamate, tungsten sodium and citric acid. The minimum pitch and the height of the pattern on Ni-W electroformed mold were about 40 μm and 3.8 μm, respectively. The thermal imprint for borosilicate glass carried out with Ni-W electroformed mold. The shape of the Ni-W electroformed mold was printed on the borosilicate glass by thermal imprint. The borosilicate glass was removed from the Ni-W electroformed mold easily.

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