Improvement of Critical Stress for Crack-Healing of Si<sub>3</sub>N<sub>4</sub>/SiC by Shot Peening

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  • ショットピーニングによる窒化ケイ素/炭化ケイ素複合材のき裂治癒可能な限界応力の向上

Abstract

Effect of shot peening on the critical stress for crack-healing of Si3N4/SiC composite ceramics was investigated. Shot peening was carried out on the Si3N4/SiC composite with a surface crack by Yittorium stabilized Zirconia beads.<br>Peend specimens were healed at 1100 °C for 5 hours in air under constant tensile stress σapp ranging from 0 to 500 MPa. The result clearly showed that peend specimens could heal the surface crack completely under the σapp ≤ 450 MPa. Thus, critical stress of the specimens was determined to be σCapp = 450 MPa. This σCapp was 2.3 times higher than that of un-peened specimen. Furthermore, the σCapp of both specimens showed the proportional relationship to bending strength of cracked specimen σcCapp ~ 0.64σc). Therefore, it can be concluded that the improved σCapp of the peened specimen is due to the compressive residual stress and, consequently, increment of σc.

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