Improvement of Critical Stress for Crack-Healing of Si<sub>3</sub>N<sub>4</sub>/SiC by Shot Peening
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- NAKAGAWA Satoshi
- 横浜国立大学大学院 工学府
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- TAKAHASHI Koji
- Faculty of Engineering Yokohama National University
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- OSADA Toshio
- 横浜国立大学 共同研究推進センター
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- SAITO Shinji
- 日本発条(株) 研究開発本部
Bibliographic Information
- Other Title
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- ショットピーニングによる窒化ケイ素/炭化ケイ素複合材のき裂治癒可能な限界応力の向上
Abstract
Effect of shot peening on the critical stress for crack-healing of Si3N4/SiC composite ceramics was investigated. Shot peening was carried out on the Si3N4/SiC composite with a surface crack by Yittorium stabilized Zirconia beads.<br>Peend specimens were healed at 1100 °C for 5 hours in air under constant tensile stress σapp ranging from 0 to 500 MPa. The result clearly showed that peend specimens could heal the surface crack completely under the σapp ≤ 450 MPa. Thus, critical stress of the specimens was determined to be σCapp = 450 MPa. This σCapp was 2.3 times higher than that of un-peened specimen. Furthermore, the σCapp of both specimens showed the proportional relationship to bending strength of cracked specimen σc (σCapp ~ 0.64σc). Therefore, it can be concluded that the improved σCapp of the peened specimen is due to the compressive residual stress and, consequently, increment of σc.
Journal
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- TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A
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TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A 79 (802), 697-701, 2013
The Japan Society of Mechanical Engineers
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Details 詳細情報について
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- CRID
- 1390001204477259904
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- NII Article ID
- 130003374644
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- ISSN
- 18848338
- 03875008
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- Text Lang
- ja
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- Data Source
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- JaLC
- Crossref
- CiNii Articles
- KAKEN
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- Abstract License Flag
- Disallowed