Manufacture and Performance of a 60GHz-Band High-Efficiency Antenna with a Thick Resin Layer and the Feed through a Hole in a Silicon Chip
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- ASANO Jun
- Department of Electrical and Electronic Engineering, Tokyo Institute of Technology
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- HIROKAWA Jiro
- Department of Electrical and Electronic Engineering, Tokyo Institute of Technology
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- NAKANO Hiroshi
- Ammsys Inc.
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- HIRACHI Yasutake
- Ammsys Inc.
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- ISONO Hiroshi
- Shiima Electronics Inc.
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- ISHII Atsushi
- Shiima Electronics Inc.
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- ANDO Makoto
- Department of Electrical and Electronic Engineering, Tokyo Institute of Technology
抄録
As a first step towards the realization of high-efficiency on-chip antennas for 60GHz-band wireless personal area networks, this paper proposes the fabrication of a patch antenna placed on a 200µm thick dielectric resin and fed through a hole in a silicon chip. Despite the large tan δ of the adopted material (0.015 at 50GHz), the thick resin reduces the conductor loss at the radiating element and a radiation efficiency of 78%, which includes the connecting loss from the bottom is predicted by simulation. This calculated value is verified in the millimeter-wave band by experiments in a reverberation chamber. Six stirrers are installed, one on each wall in the chamber, to create a statistical Rayleigh environment. The manufactured prototype antenna with a test jig demonstrates the radiation efficiency of 75% in the reverberation chamber. This agrees well with the simulated value of 76%, while the statistical measurement uncertainty of our handmade reverberation chamber is calculated as ±0.14dB.
収録刊行物
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- IEICE Transactions on Communications
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IEICE Transactions on Communications E96.B (12), 3108-3115, 2013
一般社団法人 電子情報通信学会
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詳細情報 詳細情報について
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- CRID
- 1390282679353474688
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- NII論文ID
- 130003385156
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- ISSN
- 17451345
- 09168516
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- 本文言語コード
- en
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- データソース種別
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- JaLC
- Crossref
- CiNii Articles
- KAKEN
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- 抄録ライセンスフラグ
- 使用不可
