熱化学反応を利用したナノ多結晶ダイヤモンドに対する乾式研削

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  • Dry Grinding of Nano-Polycrystalline Diamond Using Thermochemical Reaction

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A polycrystalline diamond (PCD) disk, in which the cobalt (Co) commonly used as a sintering aid is replaced with a transition metal or a high-specific-heat material, was used as a truer, and dry grinding of a laser-preformed rake face of a radius-cutting tool made of nano-polycrystalline diamond (NPD) was conducted to clarify the mechanism by which a chip is removed from the rake face. The grinding test revealed that the surface roughness decreased with decreasing frictional heat of the truer when the damaged layer on the rake face, in which the covalent linking strength was weakened owing to the transfer of electrons from the diamond to the transition metal, was removed by diamond grains on the working surface of the truer. It additionally became clear that the surface roughness decreased with increasing specific heat capacity of the material replacing the Co when the heat-damaged layer, in which the diamond structure was transformed to that of graphite, was removed by diamond grains on the working surface of the truer. A ground surface roughness of 0.5 nm Rz was obtained when the truer with Co replaced by boron carbide (B4C) was employed.

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