Interdiffusion in Cu–Mn Alloys

• Iijima Yoshiaki

  Department of Materials Science, Faculty of Engineering, Tohoku University

• Hirano Ken-ichi

  Department of Materials Science, Faculty of Engineering, Tohoku University

• Sato Kazuo

  Department of Materials Science, Faculty of Engineering, Tohoku University

書誌事項

タイトル別名

• Interdiffusion in Cu–Mn Alloys

抄録

Interdiffusion coefficient, \ ildeD, in Cu–Mn alloys has been determined by Matano’s method in the temperature range between 1021 and 1203 K with the various couples consisting of pure copper and Cu–Mn alloys. It has been found that \ ildeD increases with manganese content up to 30 at%Mn and decreases remarkably with a further increase of manganese. The concentration dependence of both the activation energy and the frequency factor for interdiffusion shows a small peak at 20 at%Mn and a very large peak at 80 at%Mn; the former is attributed to the increase in rigidity of the alloy and the latter to the deviation of the alloy from the ideal solid solution. The Kirkendall marker has been found to move toward the manganese-rich side where the Kirkendall void has been observed, indicating that the manganese atom diffuses faster than the copper atom. From the interdiffusion coefficient and velocity of the marker, the intrinsic diffusion coefficients, D_Mn and D_Cu, in 29 and 77 at%Mn alloys have been determined, and it has been shown that the ratio of D_Mn⁄D_Cu takes the value between 1.5 and 2.9.

収録刊行物

• Transactions of the Japan Institute of Metals

  Transactions of the Japan Institute of Metals 18 (12), 835-842, 1977

  社団法人 日本金属学会

キーワード

• General Engineering

詳細情報

• CRID: 1390282680095091072
• NII論文ID: 130003485546
• DOI: 10.2320/matertrans1960.18.835
• COI: 1:CAS:528:DyaE1cXptlGnsA%3D%3D
• ISSN: 24324701
• ISSN: 00214434
• Web Site: https://www.jstage.jst.go.jp/article/matertrans1960/18/12/18_12_835/_pdf
• 本文言語コード: en
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