Study of high photo-speed top surface imaging process using chemically amplified resist.

  • Mori Shigeyasu
    SHARP Corporation
  • Matsuzawa Nobuyuki
    Yokohama Research Center, Association of Super-Advanced Electronics Technologies (ASET) 292
  • Kaimoto Yuko
    Yokohama Research Center, Association of Super-Advanced Electronics Technologies (ASET) 292
  • Endo Masayuki
    Yokohama Research Center, Association of Super-Advanced Electronics Technologies (ASET) 292
  • Matsuo Takahiro
    Yokohama Research Center, Association of Super-Advanced Electronics Technologies (ASET) 292
  • Morisawa Taku
    Yokohama Research Center, Association of Super-Advanced Electronics Technologies (ASET) 292
  • Kuhara Koichi
    Yokohama Research Center, Association of Super-Advanced Electronics Technologies (ASET) 292
  • Sasago Masaru
    Yokohama Research Center, Association of Super-Advanced Electronics Technologies (ASET) 292

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タイトル別名
  • Study of High Photo-speed Top Surface I

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A positive high photo-speed top surface imaging (TSI) process for 193-nm lithography has been achieved by incorporation a chemically amplified resist consisting of photo-acid generator (PAG), cross-linker, and base polymer in the process. We found that we have to use both a chemically amplified resist with a PAG which generates acids having higher molecular weights, and a base polymer having a higher molecular weight. The photo-speed strongly depends on the post exposure bake (PEB) temperature. A required photo-speed of <5.0mJ/cm2 was obtained with PEB at 130°C under this process. We were unable to observe the trade-off between line edge roughness (LER) and photo-speed. The process achieves a resolution of 0.12μmL/S without the use of any resolution enhanced technique (RET), and 0.09μmL/S when an alternative phase shifting mask is used The process margin has a depth of focus of 0.5μm for 0.12μmL/S without RET and 0.7μm for 0.09 μmL/S with the alternative phase shifting mask. Sub-0.10-μm patterns were produced by using this TSI process for 193-nm lithography.

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