銅ワイヤステッチボンディングの接合性に関する研究　（第２報）　ワイヤ変形挙動と接合性の関係

• 藤本 公三

  大阪大学

• 升谷 雄一

  大阪大学

• 仲田 周次

  大阪大学

• 藤井 淳彦

  住友電気工業(株)

書誌事項

タイトル別名

• Investigation on Cu wire stitch bonding. (Report 2). Influence of wire deformation behavior on bondability.
• Investigation on Cu wire stitch bonding (Report 2)
• 銅ワイヤステッチボンディングの接合性に関する研究(第2報)

抄録

For the direct bonding between Cu wire and Cu alloy lead frame, the wire deformation behavior and the temperature rise at the interface between a wire and a lead terminal are very significant. In this report, the operation of the load on the bondability and the correlation between the wire deformation behavior and bondability are clarified. The wire deformation is controlled by load control, and the plastic flow and the temperature rise at the interface are depended by the equilibrium of the load and the ultrasonic vibration. By setting the higher value of the initial load, the working load can be settled the smaller value, and so the wire deformation becomes smaller and bondability is superior than that in bonding by applying the constant load.

収録刊行物

• 溶接学会論文集

  溶接学会論文集 14 (1), 174-178, 1996

  一般社団法人 溶接学会

キーワード

• Wire bonding
• stitch bonding
• Cu wire
• Load controll
• Deformation behavior

詳細情報

• CRID: 1390282679699620096
• NII論文ID: 130003764503
• DOI: 10.2207/qjjws.14.174
• COI: 1:CAS:528:DyaK28Xit1Kntbk%3D
• ISSN: 24348252
• ISSN: 02884771
• ISSN: http://id.crossref.org/issn/02884771
• 本文言語コード: ja
• データソース種別:
  • JaLC
  • Crossref
  • CiNii Articles
• 抄録ライセンスフラグ: 使用不可