ＰＷＢ上へのフリップチップ実装

• 頼 明照

  シャープ株式会社生産技術開発推進本部生産技術研究所

• 土津田 義久

  シャープ株式会社生産技術開発推進本部生産技術研究所

• 貫井 孝

  シャープ株式会社生産技術開発推進本部生産技術研究所

• 大西 哲也

  シャープ株式会社IC事業本部IC開発センター

書誌事項

タイトル別名

• Flip-Chip Bonding on PWB.

抄録

The thermal fatigue lifetime of a flip-chip COB sample has been experimentally studied using various sized chips (3 mm^_??_-15mm^_??_) bonded onto PWB. We found that in the sample without resin insertion, these lifetimes are short, which indicates that they cannot be put to practical use. Also, when a resin with a TEC (Thermal Expansion Coefficient) close to that of the solder is inserted into the gap between the chip and the substrate, the lifetime of these samples is greatly extended, which indicates that they can be put to practical use. We ran failure analysis tests on the samples without resin which failed, and clarified the mode of failure. The reliability of a 4 M-mask-ROM-chip bonded on PWB (0.25mm^t) using a solder bump was also evaluated. There were no problems in the temperature cycling test, the humidity storage test and the high temperature storage test.

収録刊行物

• サーキットテクノロジ

  サーキットテクノロジ 8 (2), 136-143, 1993

  一般社団法人 エレクトロニクス実装学会

キーワード

• General Medicine

詳細情報

• CRID: 1390001204659243264
• NII論文ID: 130004165165
• DOI: 10.5104/jiep1986.8.136
• ISSN: 1884118X
• ISSN: 09148299
• Web Site: http://www.jstage.jst.go.jp/article/jiep1986/8/2/8_2_136/_pdf
• 本文言語コード: ja
• データソース種別:
  • JaLC
  • Crossref
  • CiNii Articles
• 抄録ライセンスフラグ: 使用不可