優れたはんだ付け性と接点特性を兼備したプリント配線板の製造　無電解Ｐｄ‐Ｐ合金めっきプロセスの適用

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  • Production of PWBs Possessing Both Superior Solderability and Contact Characteristics. Application of an Electroless Pd-P Alloy Plating Process.
  • —Application of an Electroless Pd-P Alloy Plating Process—
  • ―無電解Pd-P合金めっきプロセスの適用―

抄録

Solderability and contact characteristic of printed wiring board treated with the electroless Pd-P alloy plating process were investigated. The printed wiring board treated with this process was possessing superior solderability, fixing strength of component mounting parts and contact characteristic. It was found that the process has more solderability and contact characteristic than the now in use of electroless Ni plating and of displacement Au plating process.

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