特集 実装の検査技術 レーザ式はんだ付け外観検査装置  [in Japanese] Special Articles: Automated Inspection Technology for Packaging. Applications of Laser Systems in Post-Soldr Inspection Equipments.  [in Japanese]

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Author(s)

    • 村岡 建樹 MURAOKA Tateki
    • 名古屋電機工業株式会社オプトエレクトロニクス事業部 Opto-Electronics Div., Nagoya Electric Works Co., Ltd.

Journal

  • Circuit Technology

    Circuit Technology 9(3), 163-168, 1994

    The Japan Institute of Electronics Packaging

Codes

  • NII Article ID (NAID)
    130004165236
  • Text Lang
    JPN
  • ISSN
    0914-8299
  • Data Source
    J-STAGE 
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