実装関連設備の最先端  傾斜型CTを用いた高密度実装基盤解祈  [in Japanese] The Analysis of the Substrate with High-Density Packaging Using the Oblique Computed Tomography  [in Japanese]

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Author(s)

Journal

  • Journal of The Japan Institute of Electronics Packaging

    Journal of The Japan Institute of Electronics Packaging 10(7), 528-532, 2007

    The Japan Institute of Electronics Packaging

Codes

  • NII Article ID (NAID)
    130004165626
  • Text Lang
    JPN
  • ISSN
    1343-9677
  • Data Source
    J-STAGE 
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