異方性導電樹脂接合部の接合信頼性評価

• KIM Won-Keun

  Department of Material Process Engineering, Kyushu University

• 池田 徹

  九州大学工学研究院

• 宮崎 則幸

  九州大学工学研究院

書誌事項

タイトル別名

• Evaluation of Reliability of a Joint Using Anisotropic Conductive Adhesive.
• イホウセイ ドウデン ジュシ セツゴウブ ノ セツゴウ シンライセイ ヒョウカ

抄録

Anisotropic conductive adhesive film (ACF) is an interconnection material in electronic packages such as connecting a LCD panel on a circuit substrate. It is expected to be a key technology for the chip size packaging. The goal of our work is to provide an optimum design scheme to achieve the best combination of the electrical performance and the mechanical reliability. This study presents an evaluation technology for the delamination at connections using ACF. We utilized the stress intensity factors of an interface crack between jointed dissimilar materials to evaluate the delamination strength of a connection. As the result, the residual stress of an interface between a chip and ACF is higher than that between ACF and substrate. And also we investigated the mode dependence of mechanical test, and found out that an interface crack between ACF and substrate was more affected by mode II rather than mode I at high temperature.

収録刊行物

• エレクトロニクス実装学会誌

  エレクトロニクス実装学会誌 6 (2), 153-160, 2003

  一般社団法人エレクトロニクス実装学会

キーワード

• <I>Anisotropic Conductive Film (ACF) </I>
• <I>Delamination Test</I>
• <I>Stress Intensity Factor</I>
• <I>Residual Stress</I>

詳細情報

• CRID: 1390282679537234048
• NII論文ID: 130004166022
• NII論文ID: 10013958484
• NII書誌ID: AA11231565
• DOI: 10.5104/jiep.6.153
• COI: 1:CAS:528:DC%2BD3sXislGnu74%3D
• ISSN: 1884121X
• ISSN: 13439677
• ISSN: http://id.crossref.org/issn/13439677
• NDL書誌ID: 6483902
• Web Site: https://ndlsearch.ndl.go.jp/books/R000000004-I6483902
• Web Site: http://www.jstage.jst.go.jp/article/jiep1998/6/2/6_2_153/_pdf
• 本文言語コード: ja
• データソース種別:
  • JaLC
  • NDL
  • Crossref
  • CiNii Articles
• 抄録ライセンスフラグ: 使用不可