A Pd Nanoparticle/Silica Nanoparticle/Acrylic Polymer Hybrid Layer for Direct Electroless Copper Deposition on a Polymer Substrate

• Toshiyuki Tamai

  Osaka Municipal Technical Research Institute

• Mitsuru Watanabe

  Osaka Municipal Technical Research Institute

• Shingo Ikeda

  Osaka Municipal Technical Research Institute

• Yasuyuki Kobayashi

  Osaka Municipal Technical Research Institute

• Yutaka Fujiwara

  Osaka Municipal Technical Research Institute

• Kimihiro Matsukawa

  Osaka Municipal Technical Research Institute

抄録

Copper was directly deposited on a polymer substrate whose surface is coated with a palladium nanoparticle/silica nanoparticle/acrylic polymer hybrid layer. On the surface of the hybrid, the palladium nanoparticles function as a catalyst for the electroless copper deposition, and the nanometer-scale roughness, which is due to the silica nanoparticles, increases the adhesion between the polymer and copper.

収録刊行物

• Chemistry Letters

  Chemistry Letters 41 (3), 277-279, 2012-02-25

  Oxford University Press (OUP)

キーワード

• General Chemistry

詳細情報

• CRID: 1360283694088384384
• NII論文ID: 130004426537
• DOI: 10.1246/cl.2012.277
• ISSN: 13480715
• ISSN: 03667022
• Web Site: https://academic.oup.com/chemlett/article-pdf/41/3/277/55638500/cl.2012.277.pdf
• データソース種別:
  • Crossref
  • CiNii Articles
  • KAKEN