Evaluation by Ultrasonic Testing and TEM Observation of Bond Interface for Ultrasonic Bonds of 5052/SUS304 and 5052/SPCC

• ABDEL-ALEEM Hamed

  Kyushu Institute of Technology

• KATOH Mitsuaki

  Kyushu Institute of Technology

• NISHIO Kazumasa

  Kyushu Institute of Technology

• YAMAGUCHI Tomiko

  Kyushu Institute of Technology

• TSUE Yusuke

  Kyushu Institute of Technology

抄録

We tried to bond two dissimilar combinations, 5052/SUS304 and 5052/SPCC, by ultrasonic spot bonding. The bondability of bonds was evaluated by performing ultrasonic testing and tensile shear test. In principle, good bonding was obtained by ultrasonic bonding without developing any intermetallic compounds. A good correlation between results of ultrasonic testing and tensile shear test could be obtained by selecting the appropriate threshold level in the ultrasonic testing. The microstructure in nano-scale order was observed near the bond interface using TEM to make clear the mechanism of the bonding. We could notice that amorphous structure was developed near the bond interface and this contributed the good bonding of the dissimilar materials by ultrasonic bonding.

収録刊行物

• 溶接学会論文集

  溶接学会論文集 23 (2), 194-202, 2005

  一般社団法人 溶接学会

キーワード

• Ultrasonic bonding
• Aluminum alloy
• SUS304
• SPCC
• Ultrasonic testing
• Tensile shear test
• TEM
• Intermetallic compound

詳細情報

• CRID: 1390282679701806848
• NII論文ID: 130004445426
• NII論文ID: 110003423087
• NII書誌ID: AN1005067X
• DOI: 10.2207/qjjws.23.194
• COI: 1:CAS:528:DC%2BD2MXmtFGqu7g%3D
• ISSN: 24348252
• ISSN: 02884771
• NDL書誌ID: 7375779
• Web Site: https://ndlsearch.ndl.go.jp/books/R000000004-I7375779
• 本文言語コード: en
• データソース種別:
  • JaLC
  • NDL
  • Crossref
  • CiNii Articles
• 抄録ライセンスフラグ: 使用不可