Selection of Particle Size and Solvent to Lower the Pressure Required for Metal-to-Metal Bonding using Silver Nanoparticle Pastes

• Ogura Tomo

  Graduate school of Engineering, Osaka University

• Konaka Yosuke

  Graduate school of Engineering, Osaka University

• Ide Eichi

  Materials Research Laboratory, Hitachi Ltd.

• Morita Toshiaki

  Materials Research Laboratory, Hitachi Ltd.

• Hirose Akio

  Graduate school of Engineering, Osaka University

Abstract

Bondability under lower applied pressures (0.5 and 1 MPa) was investigated on the basis of the interaction force generated between the particles and the solvent used during sintering. In the case of single (unmixed) solvents, the shear strength decreased monotonously with an increase in the molecular weight of the solvent used, regardless of the size of the particles used. This was because the decomposition of solvents with high molecular weight was not complete till bonding at 300°C. In the case of mixed solvents, the shear strength achieved using a mix of triethylene glycolol (TEG) and polyethylene glycol (PEG) 200 increased and was greater than that achieved using conventional solders. The results obtained could be explained well by the dynamics of the solvent and the particles. Thus, it was surmised that the capillary force can be effective in joining larger particles together under lower applied pressures.

Journal

• QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY

  QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY 31 (4), 197s-201s, 2013

  JAPAN WELDING SOCIETY

Keywords

• Silver nanoparticles
• Sintering
• Bonding
• Pb-free
• Low applied pressure

Details

• CRID: 1390001204724931328
• NII Article ID: 130004445763
• DOI: 10.2207/qjjws.31.197s
• COI: 1:CAS:528:DC%2BC3sXhslejs7fN
• ISSN: 24348252
• ISSN: 02884771
• Text Lang: en
• Data Source:
  • JaLC
  • Crossref
  • CiNii Articles
  • KAKEN
• Abstract License Flag: Disallowed