Inhibitory effect of Ti-Ag alloy on artificial biofilm formation

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Author(s)

    • NAKAJO Kazuko
    • Division of Oral Ecology and Biochemistry, Tohoku University Graduate School of Dentistry
    • KIKUCHI Masafumi
    • Department of Biomaterials Science, Kagoshima University Graduate School of Medical and Dental Sciences
    • TAKADA Yukyo
    • Division of Dental Biomaterials, Tohoku University Graduate School of Dentistry
    • OKUNO Osamu
    • Division of Dental Biomaterials, Tohoku University Graduate School of Dentistry
    • SASAKI Keiichi
    • Division of Advanced Prosthetic Dentistry, Tohoku University Graduate School of Dentistry
    • TAKAHASHI Nobuhiro
    • Division of Oral Ecology and Biochemistry, Tohoku University Graduate School of Dentistry

Abstract

Titanium-silver (Ti-Ag) alloy has been improved for machinability and mechanical properties, but its anti-biofilm properties have not been elucidated yet. Thus, this study aimed to evaluate the effects of Ti-Ag alloy on biofilm formation and bacterial viability in comparison with pure Ti, pure Ag and silver-palladium (Ag-Pd) alloy. Biofilm formation on the metal plates was evaluated by growing <i>Streptococcus mutans</i> and <i>Streptococcus sobrinus</i> in the presence of metal plates. Bactericidal activity was evaluated using a film contact method. There were no significant differences in biofilm formation between pure Ti, pure Ag and Ag-Pd alloy, while biofilm amounts on Ti-20% Ag and Ti-25% Ag alloys were significantly lower (<i>p</i><0.05). In addition, Ti-Ag alloys and pure Ti were not bactericidal, although pure Ag and Ag-Pd alloy killed bacteria. These results suggest that Ti-20% Ag and Ti-25% Ag alloys are suitable for dental material that suppresses biofilm formation without disturbing healthy oral microflora.

Journal

  • Dental Materials Journal

    Dental Materials Journal 33(3), 389-393, 2014

    The Japanese Society for Dental Materials and Devices

Codes

  • NII Article ID (NAID)
    130004519334
  • Text Lang
    ENG
  • ISSN
    0287-4547
  • Data Source
    J-STAGE 
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