Fracture in brittle thin film on polymer substrate

• Omiya Masaki

  Tokyo Institute of Technology

• Inoue Hirotsugu

  Tokyo Institute of Technology

• Kishimoto Kikuo

  Tokyo Institute of Technology

Bibliographic Information

Other Title

• 高分子基材上に形成した脆性薄膜の破壊

Abstract

Ceramic thin films deposited on polymer substrates are widely used such as electric devices or packages of foods. Due to thermal stresses or bending stresses, tensile stresses are induced in those brittle thin films and bring about crack formation in thin film layers. This phenomenon causes the degradation of reliability in systems. Therefore, it is important to investigate the mechanism and the criteria of crack formation in brittle thin films. To study the relation between the crack initiation and interfacial strength between thin film and polymer substrate, we carried out the in-situ observations under tensile test of ceramic/polymer composite film.

Journal

• NCTAM papers, National Congress of Theoretical and Applied Mechanics, Japan

  NCTAM papers, National Congress of Theoretical and Applied Mechanics, Japan 54 (0), 118-118, 2005

  National Committee for IUTAM

Details

• CRID: 1390282680568792192
• NII Article ID: 130004603311
• DOI: 10.11345/japannctam.54.0.118.0
• Data Source:
  • JaLC
  • CiNii Articles
• Abstract License Flag: Disallowed