マルチワイヤソーにおける加工中のスラリー挙動に関する研究 A Study on Slurry Actions in Process of Multi-wire Saw

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Abstract

遊離砥粒を用いたマルチワイヤソー方式では,砥粒と加工液の懸濁液であるスラリーを加工用工具であるワイヤ上へ供給しスライシング加工が行われる.しかし,スラリーのワイヤへの付着状態が不安定になりやすく,切断性能の低下を招く問題がある.そこで本研究では,加工部付近のスラリー挙動を高速度ビデオカメラによって観察し,遊離砥粒方式のマルチワイヤソーにおける加工メカニズムについて検討した結果を述べる.

The multi-wire saw is one of the effective slicing methods to make base wafer of IC or LSI, and uses the slurry in processing. The slurry is the working fluid mixed abrasive grains. In this slicing method, the slurry is supplied on the tensioned thin piano wire and is carried to processing area with the motion of wire running. Therefore, the adhesion conditions and behavior of slurry affect the slicing characteristics. This paper observed the slurry behavior in the slicing grooves and at the processing area by means of high speed camera, and the relationship between slurry behavior and slicing characteristics was studied and the processing mechanism of multi-wire saw was considered.

Journal

  • Proceedings of JSPE Semestrial Meeting

    Proceedings of JSPE Semestrial Meeting 2005S(0), 2-2, 2005

    The Japan Society for Precision Engineering

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