A Study on Slurry Actions in Process of Multi-wire Saw

• Ishikawa Ken-ichi

  Kanazawa Institute of Technology

• Suwabe Hitoshi

  Kanazawa Institute of Technology

• Iwasaki Souichi

  Kanazawa Institute of Technology

Bibliographic Information

Other Title

• マルチワイヤソーにおける加工中のスラリー挙動に関する研究

Abstract

The multi-wire saw is one of the effective slicing methods to make base wafer of IC or LSI, and uses the slurry in processing. The slurry is the working fluid mixed abrasive grains. In this slicing method, the slurry is supplied on the tensioned thin piano wire and is carried to processing area with the motion of wire running. Therefore, the adhesion conditions and behavior of slurry affect the slicing characteristics. This paper observed the slurry behavior in the slicing grooves and at the processing area by means of high speed camera, and the relationship between slurry behavior and slicing characteristics was studied and the processing mechanism of multi-wire saw was considered.

Journal

• Proceedings of JSPE Semestrial Meeting

  Proceedings of JSPE Semestrial Meeting 2005S (0), 2-2, 2005

  The Japan Society for Precision Engineering

Keywords

• Multi-wire Saw
• Slurry

Details

• CRID: 1390001205650079616
• NII Article ID: 130004657374
• DOI: 10.11522/pscjspe.2005s.0.2.0
• Data Source:
  • JaLC
  • CiNii Articles
  • KAKEN
• Abstract License Flag: Disallowed