Singulation Characteristics of Semiconductor Package Using Pulsed Fiber Laser and SHG:YAG Laser

• Okamoto Yasuhiro

  Okayama University

• Kitada Ryoji

  Okayama University

• Okada Akira

  Okayama University

• Uno Yoshiyuki

  Chugoku Polytechnic College

抄録

A laser singulation method by the superposition of a pulsed fiber laser and an SHG:YAG laser (SHG: Second Harmonic Generation) was proposed to perform the high-quality processing of semiconductor packages, which are consisted of thermosetting epoxy-resin with silica as the molding compounds and a glass epoxy board with insulator coatings for the semiconductor package. The superposition of the pulsed fiber laser and SHG:YAG laser with a high pulse repetition rate led to a straighter kerf shape with a smaller kerf width under the same pulse energy condition. A smaller kerf width was achieved by controlling the time-delay between the laser pulses compared with synchronized laser pulses. The heat affected zone from the cut surface was reduced by the superposition of the pulsed fiber laser and SHG:YAG laser. Moreover, synchronized laser pulses led to a smaller heat affected zone compared with unsynchronized pulses.

収録刊行物

• International Journal of Electrical Machining

  International Journal of Electrical Machining 19 (0), 28-33, 2014

  一般社団法人 電気加工学会

キーワード

• singulation
• semiconductor package
• pulsed fiber laser
• SHG:YAG laser

詳細情報

• CRID: 1390282680732481024
• NII論文ID: 130004709077
• NII書誌ID: AN10564586
• DOI: 10.2526/ijem.19.28
• ISSN: 21885117
• ISSN: 13417908
• NDL書誌ID: 028573074
• Web Site: https://ndlsearch.ndl.go.jp/books/R000000004-I028573074
• 本文言語コード: en
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