Study on UV-Assisted Polishing of Diamond Wafer for Power Electric Devices

• TAGAWA Tomohiko

  熊本大学大学院

• TOUGE Mutsumi

  熊本大学大学院

• SAKAMOTO Takeshi

  熊本大学大学院

• SHIKATA Shinichi

  産業技術総合研究所

• YAMADA Hideaki

  産業技術総合研究所

• KATO Yukako

  産業技術総合研究所

Bibliographic Information

Other Title

• デバイス用ダイヤモンドウェハのUVアシスト研磨に関する研究

Abstract

Diamond materials are expected to be used as future substrates for power devices because they have excellent material properties, such as remaining stable at high temperatures and high resistance to chemical environments. On the other hand, etching and mechanical processing are very difficult because of the chemical and physical properties of diamond. As device materials must be polished without crystallographic distortion beneath a polished substrate, simplified planarization techniques accompanied with high surface quality are especially required. Ultraviolet rays excited polishing of single crystal diamond substrates has been studied in our laboratory, and the UV-assisted polishing characteristics, such as a higher polishing rate and superior final surface roughness, have been revealed. By using these polishing techniques, we can use diamond as a substrate material for future power devices because we are able to polish a mosaic wafer containing joined samples of two or more substrates, and minimize the occurrence of dislocation on the polished substrate. This paper reports the effective in diamond substrate for power device.

Journal

• Journal of the Japan Society for Precision Engineering

  Journal of the Japan Society for Precision Engineering 80 (6), 587-591, 2014

  The Japan Society for Precision Engineering

Keywords

• ultra violet-ray
• single crystal diamond
• tribology
• UV-excitation
• polishing
• diamond substrate

Details

• CRID: 1390001204830355072
• NII Article ID: 130004745482
• DOI: 10.2493/jjspe.80.587
• ISSN: 1882675X
• ISSN: 09120289
• Text Lang: ja
• Data Source:
  • JaLC
  • Crossref
  • CiNii Articles
  • KAKEN
• Abstract License Flag: Disallowed