Copper surface planarization process using polyglycerol-functionalized diamond nanoparticles
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- MURAI Ryota
- Osaka University
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- TAKAYA Yasuhiro
- Osaka University
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- HAYASHI Terutake
- Osaka University
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- MICHIHATA Masaki
- Osaka University
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- KOMATSU Naoki
- Shiga University of Medical Science
Bibliographic Information
- Other Title
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- ポリグリセロール修飾ナノダイヤモンドを用いた銅膜の平坦化加工に関する研究
- ポリグリセロール シュウショク ナノダイヤモンド オ モチイタ ドウマク ノ ヘイタンカ カコウ ニ カンスル ケンキュウ
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Abstract
As multilayer copper wiring is constructed, the planarized topographical features of the copper layers become increasingly important. One of the most promising techniques for surface planarization is chemical mechanical polishing (CMP). CMP is a highly efficient process due to the varied chemical and physical properties of the slurry, which is composed of abrasive particles suspended in a chemical solution. In this study, polyglycerol-functionalized nanodiamond (ND-PG) is proposed as a suitable abrasive for copper CMP. As ND-PG has good features such as small diameter, high water solubility, and no risk of metallic contamination, it is available for next-generation design rules of semiconductors. In this paper, the planarization performance of ND-PG is investigated. It is experimentally confirmed that a slurry containing ND-PG improves the RMS surface roughness from 20 to 1 nm.
Journal
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- Journal of the Japan Society for Abrasive Technology
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Journal of the Japan Society for Abrasive Technology 58 (2), 97-102, 2014
The Japan Society for Abrasive Technology
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Details 詳細情報について
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- CRID
- 1390282679309946624
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- NII Article ID
- 130004835699
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- NII Book ID
- AN10192823
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- ISSN
- 18807534
- 09142703
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- NDL BIB ID
- 025194911
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- Text Lang
- ja
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- Data Source
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- JaLC
- NDL
- CiNii Articles
- KAKEN
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- Abstract License Flag
- Disallowed