Electric and Thermal Transport Calculations through Interface and Applications to Thermoelectric Energy Conversion

  • Hirose Kenji
    Smart Energy Research Laboratories, NEC Corporation, Japan Materials for Thermal Energy Conversion Open Laboratory, NIMS Open Innovation Center (NOiC), Tsukuba Innovation Arena (TIA), Japan
  • Kobayashi Kazuaki
    Materials for Thermal Energy Conversion Open Laboratory, NIMS Open Innovation Center (NOiC), Tsukuba Innovation Arena (TIA), Japan National Institute for Materials Science, Japan
  • Shimono Masato
    Materials for Thermal Energy Conversion Open Laboratory, NIMS Open Innovation Center (NOiC), Tsukuba Innovation Arena (TIA), Japan National Institute for Materials Science, Japan
  • Ishii Hiroyuki
    Materials for Thermal Energy Conversion Open Laboratory, NIMS Open Innovation Center (NOiC), Tsukuba Innovation Arena (TIA), Japan Institute of Applied Physics, University of Tsukuba, Japan
  • Kobayashi Nobuhiko
    Materials for Thermal Energy Conversion Open Laboratory, NIMS Open Innovation Center (NOiC), Tsukuba Innovation Arena (TIA), Japan Institute of Applied Physics, University of Tsukuba, Japan

抄録

We present the electrical and thermal transport calculations through interface of metallic aluminum and semiconductor silicon materials. The obtained transport results are utilized to find the thermoelectric properties of Seebeck coefficient and figure of merits. We find that the increase of Seebeck coefficients and also the decrease of thermal transport due to the scatterings of electrons and phonons at the nanometer-size interface enhances the efficiency of thermoelectric energy conversion around the Fermi energy. [DOI: 10.1380/ejssnt.2014.115]

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