Electric and Thermal Transport Calculations through Interface and Applications to Thermoelectric Energy Conversion
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- Hirose Kenji
- Smart Energy Research Laboratories, NEC Corporation, Japan Materials for Thermal Energy Conversion Open Laboratory, NIMS Open Innovation Center (NOiC), Tsukuba Innovation Arena (TIA), Japan
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- Kobayashi Kazuaki
- Materials for Thermal Energy Conversion Open Laboratory, NIMS Open Innovation Center (NOiC), Tsukuba Innovation Arena (TIA), Japan National Institute for Materials Science, Japan
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- Shimono Masato
- Materials for Thermal Energy Conversion Open Laboratory, NIMS Open Innovation Center (NOiC), Tsukuba Innovation Arena (TIA), Japan National Institute for Materials Science, Japan
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- Ishii Hiroyuki
- Materials for Thermal Energy Conversion Open Laboratory, NIMS Open Innovation Center (NOiC), Tsukuba Innovation Arena (TIA), Japan Institute of Applied Physics, University of Tsukuba, Japan
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- Kobayashi Nobuhiko
- Materials for Thermal Energy Conversion Open Laboratory, NIMS Open Innovation Center (NOiC), Tsukuba Innovation Arena (TIA), Japan Institute of Applied Physics, University of Tsukuba, Japan
抄録
We present the electrical and thermal transport calculations through interface of metallic aluminum and semiconductor silicon materials. The obtained transport results are utilized to find the thermoelectric properties of Seebeck coefficient and figure of merits. We find that the increase of Seebeck coefficients and also the decrease of thermal transport due to the scatterings of electrons and phonons at the nanometer-size interface enhances the efficiency of thermoelectric energy conversion around the Fermi energy. [DOI: 10.1380/ejssnt.2014.115]
収録刊行物
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- e-Journal of Surface Science and Nanotechnology
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e-Journal of Surface Science and Nanotechnology 12 (0), 115-118, 2014
公益社団法人 日本表面真空学会
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詳細情報 詳細情報について
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- CRID
- 1390001205185747968
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- NII論文ID
- 130004933807
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- ISSN
- 13480391
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- 本文言語コード
- en
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- データソース種別
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- JaLC
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- KAKEN
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- 抄録ライセンスフラグ
- 使用不可