めっき銅薄膜の機械的特性と基板繊維構造を考慮した実装基板スルーホールの熱疲労寿命評価

• 山寄 優

  (株)東芝 研究開発センター

• 釘宮 哲也

  (株)東芝 研究開発センター

• 廣畑 賢治

  (株)東芝 研究開発センター

• 八甫谷 明彦

  (株)東芝セミコンダクター＆ストレージ社

• 大野 信忠

  名古屋大学大学院工学研究科

• 坂根 政男

  立命館大学理工学部機械工学科

書誌事項

タイトル別名

• Thermal fatigue life evaluation of substrate with Cu through-hole considering the mechanical properties of Cu thin film and glass fiber cloths structure

抄録

In this study, the thermal fatigue life of substrate with Cu through-hole is evaluated by considering the mechanical properties of Cu thin film and glass fiber cloths structure. We first conducted tensile tests of Cu thin film and found that the rate-dependence of inelastic property varies abruptly with temperature. An inelastic constitutive model for Cu thin film is then proposed by combining both rate-independent and rate-dependent models. The proposed inelastic constitutive model is introduced in a Finite Element Method based analysis of glass epoxy substrate with Cu through-hole. Moreover, low cycle tests of Cu thin film are carried out by using repeated 4-point bending to evaluate its isothermal fatigue properties. Through our analysis we verified the capability of the proposed model to predict thermal fatigue life of Cu through-hole using the isothermal fatigue properties. The results show that the glass fiber cloths structure of the substrate needs to be considered in order to successfully predict the thermal fatigue life of the Cu through-hole.

収録刊行物

• 日本機械学会論文集

  日本機械学会論文集 81 (821), 14-00382-14-00382, 2015

  一般社団法人 日本機械学会

キーワード

• Fenite element method
• Glass cloth structure
• Through-hole
• Homogenization method
• Inelastic consititutive model
• Fatigue life prediction

詳細情報

• CRID: 1390001205515869952
• NII論文ID: 130005005008
• DOI: 10.1299/transjsme.14-00382
• ISSN: 21879761
• Web Site: https://www.jstage.jst.go.jp/article/transjsme/81/821/81_14-00382/_pdf
• 本文言語コード: ja
• データソース種別:
  • JaLC
  • Crossref
  • CiNii Articles
  • KAKEN
• 抄録ライセンスフラグ: 使用不可