Study on Variable Rotation Polishing in CMP Process (1st report)

• Phaisalpanumas Pipat

  九工大　Graduate School of Computer Science and Systems Engineering

• Keiichi Kimura

  九工大　Graduate School of Computer Science and Systems Engineering

• Keisuke Suzuki

  九工大　Graduate School of Computer Science and Systems Engineering

• Khajornrungruang Panart

  九工大　Graduate School of Computer Science and Systems Engineering

書誌事項

タイトル別名

• Investigation of the Variable Rotation Polishing Efficiency

抄録

In this study, a novel Variable Rotation Polishing method would be proposed in order to increase the unsteady slurry flow in CMP process for increasing the polishing efficiency and for flowing slurry into the center of wafer sufficiently when the wafer becomes larger and also in case of saving the slurry. We developed a control unit to control platen variable rotation speed and rotation direction and rotation angle. This paper investigates the efficiency of variable rotation in CMP process. Consequently, material removals of all conditions in case of Variable Rotation Polishing were higher than only forward rotation.

収録刊行物

• 精密工学会学術講演会講演論文集

  精密工学会学術講演会講演論文集 2013S (0), 649-650, 2013

  公益社団法人 精密工学会

キーワード

• Variable Rotation
• Polishing
• CMP Process
• back and forth

詳細情報

• CRID: 1390001205655873536
• NII論文ID: 130005031918
• DOI: 10.11522/pscjspe.2013s.0.649.0
• 本文言語コード: en
• データソース種別:
  • JaLC
  • CiNii Articles
• 抄録ライセンスフラグ: 使用不可