Three-dimensional Dielectrophoresis with Dielectric Pillar Arrays Fabricated by Soft Lithography

  • Watabe Ryo
    Dept. of Electrical Engineering, Shibaura Institute of Technology
  • Uchida Satoshi
    Graduate School of Science and Engineering, Tokyo Metropolitan University
  • Nishikawa Hiroyuki
    Dept. of Electrical Engineering, Shibaura Institute of Technology

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Other Title
  • ソフトリソグラフィによる誘電体ピラーを利用した3次元誘電泳動効果
  • ソフトリソグラフィ ニ ヨル ユウデンタイ ピラー オ リヨウ シタ 3ジゲン ユウデン エイドウ コウカ

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Abstract

We studied 3D dielectrophoretic (DEP) effects induced by dielectric pillar arrays fabricated by soft lithography. Polydimethylsiloxane (PDMS) was casted onto a PMMA mold with arrays of high-aspect-ratio holes micromachined by proton beam writing (PBW), which is a novel direct-write lithographic technique using a scanning proton beam. Arrays of PDMS pillars with diameter of ∼3 µm and a height of ∼15 µm, were fabricated using the soft lithography. The 3D-DEP effect was demonstrated using the PDMS pillar arrays incorporated into a channel on a glass substrate by measuring a trapping capability of E. coli. Coupled use of the soft lithgraphy with the PBW enables us to fabricate low-cost 3D-DEP devices with improved throughput.

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